QFN Packaging Market 2017: Global Market Synopsis, Growth Factors, Industry Segmentation, Regional Analysis And Competitive Analysis Forecast 2025

2018-04-05 11:27:17

According to a new report published by Reports Monitor titled, “QFN Packaging Market by Type, Property & Applications: Global Opportunity Analysis and Industry Forecast, 2017–2025,” the QFN Packaging Market was valued at XX million in 2016 and is projected to reach at XX million by 2025, growing at a CAGR of XX% from 2017 to 2025. Asia Pacific dominates the QFN Packaging Market, both in terms of volume and value, and is expected to maintain this trend throughout the forecast period. 


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Flat no-leads are a surface-mount technology. Flat no-leads packages for instance quad-flat no leads(QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. It is also known as micro lead frame (MLF) and SON (small-outline no leads). Flat no leads are one of several package technologies which connect ICs to the surfaces of PCBs without through-holes. The QFN package also includes an exposed thermal pad at the package bottom to facilitate heat dissipation from the die.


The QFN packaging market is increasing due to various driving factors such as increased reliability on wireless applications, growing adoption of portable devices, small form factor, good thermal performance, and increasing applications in the automobile sector. The car manufacturer provides the accessories such as keyless locks and unlock systems for car doors. These devices may boost the demand for QFN package.


On the basis of segmentation, the market is divided by type, by application, by QFN variants, and by region. According to the type the market is divided into air-cavity QFNs and plastic molded QFNs. According to the application, the market is bifurcated into portable devices, radio frequency (RF), wearable devices, and others. There are different QFN variants such as very thin quad flat no-lead (VQFN), ultrathin quad flat no-lead (UQFN), quad flat no-lead(QFN), and others.


Key Question Answered:

• What will be the market size in 2025 and at what rate it will grow?

• Who are the major key players in global QFN packaging market and what are their strategies?

• Which vertical industry is expected to show major growth?

• What segment and region will lead the market and why?


The major companies profiled in the report include: Amkor Technology, ASE Group, Fujitsu Ltd, Linear Technology Corporation, Microchip Technology Inc, NXP Semiconductor, STATS ChipPAC Pte. Ltd, Texas Instruments, Toshiba Corporation, UTAC Group, and others.


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